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TSL230RD, TSL230ARD, TSL230BRD
PROGRAMMABLE LIGHT-TO-FREQUENCY CONVERTERS
TAOS054P  OCTOBER 2007
11
The LUMENOLOGY r Company
r
r
Copyright E 2007, TAOS Inc.
www.taosinc.com
MANUFACTURING INFORMATION
The Plastic Small Outline IC package (D) has been tested and has demonstrated an ability to be reflow soldered
to a PCB substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The component should
be limited to a maximum of three passes through this solder reflow profile.
Table 1. TSL230RD Solder Reflow Profile
PARAMETER
REFERENCE
TSL230RD
Average temperature gradient in preheating
2.5癈/sec
Soak time
t
soak
2 to 3 minutes
Time above 217癈
t
1
Max 60 sec
Time above 230癈
t
2
Max 50 sec
Time above T
peak
 10?/SPAN>C
t
3
Max 10 sec
Peak temperature in reflow
T
peak
260?C (0癈/+5癈)
Temperature gradient in cooling
Max 5癈/sec
t
3
t
2
t
1
t
soak
T
3
T
2
T
1
T
peak
Not to scale  for reference only
Time (sec)
Figure 10. TSL230RD Solder Reflow Profile Graph
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